On March 20, the U.S. Department of Commerce issued a major announcement revealing that the U.S. government had entered into a non-binding preliminary Memorandum of Understanding (PMT) with Intel. Under the agreement, the U.S. government will provide Intel with up to $8.5 billion in funding under the U.S. Chip and Science Act and provide up to $11 billion in loans to support the semiconductor giant's projects in multiple U.S. States.

According to a statement released by the U.S. Department of Commerce, Intel expects to make more than $100 billion in major investments in the United States over the next five years. This investment, on the one hand, is used to produce cutting-edge semiconductors at large plants in Arizona and Ohio. On the other hand, it will also be used for advanced packaging projects and equipment development at small plants in Oregon and New Mexico.

The impact of this investment is expected to be far-reaching, creating approximately 10,000 direct manufacturing jobs and nearly 20,000 project-related construction jobs. This will greatly promote the development of the U.S. semiconductor industry and provide a substantial boost to the economy and job creation.

The collaboration between the U.S. government and Intel underscores the importance of driving technological innovation and advancing semiconductor R&D and production. The news received widespread attention, with most seeing it as a positive step toward strengthening the U.S. semiconductor industry and ensuring its global competitiveness. It will also have a transformative impact on the U.S. semiconductor landscape, making the U.S. a key player in the global semiconductor market.